Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157157 | Pressing machine and pressed product manufacturing method | Fujio Mori, Seiji Kobayashi, Akihiro SHIINO, Ken Hibino | 2024-12-03 |
| 9136232 | Method for bonding wafers and structure of bonding part | Takeshi Fujiwara, Toshiaki Okuno, Junya Yamamoto, Kenichi Hinuma, Yoshiki Ashihara +1 more | 2015-09-15 |
| 8975736 | Wafer level package, chip size package device and method of manufacturing wafer level package | Toshiaki Okuno, Takeshi Fujiwara, Tomonori Seki | 2015-03-10 |
| 8188556 | Semiconductor sensor and method of manufacturing the same | Yoshitaka Adachi | 2012-05-29 |
| 7124417 | Attaching and detaching mechanism | Shigeo Hiramoto | 2006-10-17 |
| 7007287 | Attaching and detaching mechanism | Shigeo Hiramoto | 2006-02-28 |
| 6971112 | Attaching and detaching mechanism | Shigeo Hiramoto | 2005-11-29 |
| 6971113 | Attaching and detaching mechanism | Shigeo Hiramoto | 2005-11-29 |
| 6904606 | Attaching and detaching mechanism for a front operating panel of a vehicle-mounted audio unit | Shigeo Hiramoto | 2005-06-07 |
| 6820036 | Monitoring system | Misayo Kitamura, Taizo Kojima | 2004-11-16 |