Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12252613 | Packaging film and preparation method thereof, and filter chip packaging method | De Wu, Ting Li, Shuhang Liao | 2025-03-18 |
| 12255175 | Wafer warpage regulation epoxy functional film, and preparation method and application thereof | De Wu, Qiao Zhou, Shuhang Liao | 2025-03-18 |
| 12209171 | Liquid epoxy molding compound and preparation method thereof | De Wu, Shengquan Wang, Shuhang Liao | 2025-01-28 |
| 12098230 | Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure | De Wu, Yi-Ching Wang, Shuhang Liao | 2024-09-24 |
| 12037488 | Liquid molding compound and preparation method thereof | De Wu, Shengquan Wang, Shuhang Liao | 2024-07-16 |
| 12024591 | Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrate | De Wu, Yi-Ching Wang, Shuhang Liao | 2024-07-02 |
| 11978686 | Chip protective film and method for manufacturing same, and chip | De Wu, Shuhang Liao, Liu Zhang | 2024-05-07 |
| 11879076 | Composition, adhesive film and chip packaging structure | De Wu, Shuhang Liao, Ting Li | 2024-01-23 |
| 11804463 | Underfill for chip packaging and chip packaging structure | De Wu, Shengquan Wang, Yi-Ching Wang, Shuhang Liao | 2023-10-31 |
| 11767450 | Adhesive, die attach film and preparation method therefor | De Wu, Shuhang Liao, Ting Li, Yi-Ching Wang | 2023-09-26 |
| 11643499 | Liquid molding compound for protecting five edges of semiconductor chip and preparation method thereof | De Wu, Shuhang Liao, Yi-Ching Wang, Shengquan Wang | 2023-05-09 |
| 11286386 | Circuit build-up film for wafer-level packaging, and fabrication method and use thereof | De Wu, Shuhang Liao, Yi-Ching Wang, Feifei Liang | 2022-03-29 |