Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12375083 | Superconducting phase-change material switch | Robert M. Young, Aurelius L. Graninger, Dustin Ray Johnson | 2025-07-29 |
| 12354988 | Bump structures for low temperature chip bonding | Jeffrey David Hartman | 2025-07-08 |
| 11616187 | Superconducting bump bond electrical characterization | Aurelius L. Graninger, Joel D. Strand, Micah John Atman Stoutimore, Zachary Kyle Keane, Jeffrey David Hartman | 2023-03-28 |
| 10950778 | Superconducting bump bond electrical characterization | Aurelius L. Graninger, Joel D. Strand, Micah John Atman Stoutimore, Zachary Kyle Keane, Jeffrey David Hartman | 2021-03-16 |
| 10651233 | Method for forming superconducting structures | Jeffrey David Hartman | 2020-05-12 |
| 10644218 | Multichip device with temperature isolating bump bonds | Aaron Ashley Hathaway, Robert M. Young, Patrick Alan Loney | 2020-05-05 |