| 12324126 |
Actively cooled heat-dissipation lids for computer processors and processor assemblies |
Bernard Malouin |
2025-06-03 |
| 12289871 |
High temperature electronic device thermal management system |
Bernard Malouin |
2025-04-29 |
| 12288733 |
Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies |
Bernard Malouin, Stuart Putz |
2025-04-29 |
| 12289861 |
Liquid-in-liquid cooling system for electronic components |
Bernard Malouin, Eric A. Browne |
2025-04-29 |
| 12100643 |
Thermal management of electronics using co-located microjet nozzles and electronic elements |
Bernard Malouin |
2024-09-24 |
| 12048118 |
Flow-through, hot-spot-targeting immersion cooling assembly |
Bernard Malouin |
2024-07-23 |
| 12016157 |
Actively cooled heat-dissipation lids for computer processors and assemblies |
Bernard Malouin |
2024-06-18 |
| 11963341 |
High temperature electronic device thermal management system |
Bernard Malouin |
2024-04-16 |
| 11844193 |
Direct contact fluid based cooling module |
Bernard Malouin |
2023-12-12 |
| 11277937 |
Re-entrant flow cold plate |
Bernard Malouin |
2022-03-15 |
| 11191184 |
Direct contact fluid based cooling module |
Bernard Malouin |
2021-11-30 |
| 10746475 |
Multi-phase thermal control apparatus, evaporators and methods of manufacture thereof |
Scott N. Roberts, Arthur J. Mastropietro, Benjamin I. Furst, Eric T. Sunada, Hiroki Nagai +1 more |
2020-08-18 |
