Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7750462 | Microelectromechanical systems using thermocompression bonding | Michael B. Cohn | 2010-07-06 |
| 7276789 | Microelectromechanical systems using thermocompression bonding | Michael B. Cohn | 2007-10-02 |
| 6853067 | Microelectromechanical systems using thermocompression bonding | Michael B. Cohn | 2005-02-08 |
| 5504026 | Methods for planarization and encapsulation of micromechanical devices in semiconductor processes | — | 1996-04-02 |
| 4860232 | Digital technique for precise measurement of variable capacitance | Hae-Seung Lee, Roger T. Howe | 1989-08-22 |