Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8415586 | Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses | Weisheng Lei, Glenn Simenson, Hisashi Matsumoto | 2013-04-09 |
| 8116341 | Multiple laser wavelength and pulse width process drilling | Weisheng Lei, Yunlong Sun, Yasu Osako, Glenn Simenson, Hisashi Matsumoto | 2012-02-14 |
| 7605343 | Micromachining with short-pulsed, solid-state UV laser | Weisheng Lei, Glenn Simenson, Hisashi Matsumoto | 2009-10-20 |
| 7057133 | Methods of drilling through-holes in homogenous and non-homogenous substrates | Weisheng Lei | 2006-06-06 |
| 5591353 | Reduction of surface copper thickness on surface mount printed wire boards with copper plated through holes by the chemical planarization method | Don J. Jermain, Leslie O. Connally | 1997-01-07 |