Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6574114 | Low contact force, dual fraction particulate interconnect | Steven R. Brindle, Frank E. Bumb, Jr., Kwang-Ho Chu, Alexander R. Mathews, Ronald K. Revell | 2003-06-03 |
| 4865562 | Overmolded electrical contact for the manufacture of connectors | Hirochika Enn, Lane A. Freshwater | 1989-09-12 |