Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11385118 | Pressure sensor with external vertical electrical interconnection system | Joe Wang, David W. Ivaska, Richard E. Cronin, Erich Mattmann, Frank Langner | 2022-07-12 |
| 11187605 | Sealing glass geometries for sensitivity enhancement of thick-film piezoresistive pressure sensors | Zhijun Guo, Paul W. Haack, Richard E. Cronin | 2021-11-30 |
| 9395259 | Piezoresistive transducer with low thermal noise | Jen-Huang Albert Chiou, Xiaoyi Ding, Shiuh-Hui Steven Chen | 2016-07-19 |
| 8791539 | Thin semiconductor device having embedded die support and methods of making the same | Xiaoyi Ding, Gregory A. Miller | 2014-07-29 |
| 8791540 | Thin semiconductor device having embedded die support and methods of making the same | Xiaoyi Ding, Gregory A. Miller | 2014-07-29 |
| 8618675 | Thin semiconductor die package | Xiaoyi Ding | 2013-12-31 |
| 8215176 | Pressure sensor for harsh media sensing and flexible packaging | Xiaoyi Ding, Jen-Huang Albert Chiou | 2012-07-10 |
| 8164153 | Thin semiconductor device having embedded die support and methods of making the same | Xiaoyi Ding, Gregory A. Miller | 2012-04-24 |
| 7204737 | Hermetically sealed microdevice with getter shield | Xiaoyi Ding, John Schuster | 2007-04-17 |
| 6929974 | Feedthrough design and method for a hermetically sealed microdevice | Xiaoyi Ding | 2005-08-16 |