Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11528802 | Integrated functional multilayer structure and method of manufacture therefor | Tapio Rautio, Tomi Simula, Minna Pirkonen, Tuukka Junkkari, Janne Asikkala +1 more | 2022-12-13 |
| 11516920 | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2022-11-29 |
| 11406021 | System for manufacturing an electromechanical structure | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2022-08-02 |
| 11363720 | System for manufacturing an electromechanical structure | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2022-06-14 |
| 10986733 | Method for manufacturing an electromechanical structure | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2021-04-20 |
| 10986734 | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2021-04-20 |
| 10986735 | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2021-04-20 |
| 10813222 | System for manufacturing an electromechanical structure | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2020-10-20 |
| 10660211 | Method for manufacturing an electromechanical structure | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2020-05-19 |
| 10642433 | Multilayer structure with embedded multilayer electronics | Jarmo Sääski, Pasi Raappana, Mikko Heikkinen | 2020-05-05 |
| 10575407 | System for carrying out a manufacturing method on an electro chemical structure | Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Mikko Sippari, Pasi Raappana +1 more | 2020-02-25 |
| 10383232 | Thermoformed plastic cover for electronics and related method of manufacture | Mikko Heikkinen, Jarmo Sääski | 2019-08-13 |
| 10248277 | Multilayer structure with embedded multilayer electronics | Jarmo Sääski, Pasi Raappana, Mikko Heikkinen | 2019-04-02 |
| 10064282 | Thermoformed plastic cover for electronics and related method of manufacture | Mikko Heikkinen, Jarmo Sääski | 2018-08-28 |
| 9724869 | Multilayer structure for accommodating electronics and related method of manufacture | Paavo Niskala, Jarmo Sääski, Pasi Raappana, Mikko Heikkinen, Mikko Sippari +1 more | 2017-08-08 |