JA

Jaesun An

AE Advanced Semiconductor Engineering: 2 patents #403 of 1,073Top 40%
Overall (All Time): #2,081,711 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8592958 Chip package and manufacturing method thereof Dongkyun Ko, Jung Won Lee 2013-11-26
8093690 Chip package and manufacturing method thereof Dongkyun Ko, Jung Won Lee 2012-01-10