Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11613651 | High heat-resistant composition and method of manufacturing three-dimensional substrate using the same | Jin Nyoung Heo, Dae Hwan Kim, Jeong Su Oh, Jong-Kap Jo, Yu Sik Jeon +1 more | 2023-03-28 |
| 7352050 | Fuse region of a semiconductor region | Chang-Suk Hyun, Il-Young Moon, Kang Yoon Lee, Kwang-Bo Sim, Sang-Kil Jeon | 2008-04-01 |
| 7180154 | Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same | Tai-Heui Cho, Heui-Won Shin, Gwang-Seon Byun, Sun-joon Kim | 2007-02-20 |
| 6984895 | Bonding pad structure of a semiconductor device | Tai-Heui Cho, Min Chul Kim, Byung Yoon Kim | 2006-01-10 |
| 6867070 | Bonding pad structure of a semiconductor device and method for manufacturing the same | Tai-Heui Cho, Min Chul Kim, Byung Yoon Kim | 2005-03-15 |