HC

HongLiang Cai

Futurewei Technologies: 2 patents #668 of 1,563Top 45%
Overall (All Time): #1,909,424 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10672730 Semiconductor package having reduced internal power pad pitch Shiqun Gu, Hongying Zhang 2020-06-02
10304792 Semiconductor package having reduced internal power pad pitch Shiqun Gu, Hongying Zhang 2019-05-28