HK

Hiroo Kamikawa

UN Unitika: 4 patents #66 of 620Top 15%
NE Nec: 1 patents #7,889 of 14,502Top 55%
Overall (All Time): #1,125,129 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
11608427 Resin composition for shaping material of fused deposition modeling method-3D printer and filamentary molded body thereof Miho Nakai, Azusa Usui, Shohei Kumazawa, Shota NOGUCHI, Fumio Matsuoka 2023-03-21
9879127 Semiaromatic polyamide resin composition and molded body formed by molding same Junichi Mii, Yutaka Taketani, Taiyo Amari, Yohei Kabashima 2018-01-30
8933160 Resin composition and product molded from the same 2015-01-13
8586658 Polylactic acid resin composition and molded item Shin Serizawa, Tsunenori Yanagisawa, Kazuhiko Inou, Masatoshi Iji, Yohei Kabashima +2 more 2013-11-19