Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5144938 | Method and device for resharpening saws especially used for making semiconductor wafers | Peter Lehfeld, Wolf-Rüdiger Kurtze | 1992-09-08 |
| 5036274 | Method of monitoring the path of an annular blade through a semiconductor material | — | 1991-07-30 |