HS

Herbert Schwarzbauer

SA Siemens Aktiengesellschaft: 22 patents #259 of 22,248Top 2%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
Overall (All Time): #185,755 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8110927 Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof 2012-02-07
7932585 Electrical component and film composite laminated on the component and method for production Laurence Amigues, Michael Kaspar 2011-04-26
7897881 Arrangement for hermetically sealing components, and method for the production thereof Michael Kaspar, Karl Weidner 2011-03-01
7402457 Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces Kerstin Häse, Laurence Amigues, Norbert Seliger, Karl Weidner, Jörg Zapf +1 more 2008-07-22
7057275 Device with power semiconductor components for controlling the power of high currents and use of said device Norbert Seliger 2006-06-06
6823915 Heat-conducting adhesive joint with an adhesive-filled, porous heat conductor 2004-11-30
6776329 Method for producing a heat-conducting connection between two work pieces 2004-08-17
6584681 Method for producing a microelectronic component of sandwich construction Leo Lorenz, Michael Kaindl, Gerhard Munzing, Peter Stern, Manfred Bruckmann 2003-07-01
6559532 Matrix converter Walter Springmann, Eckhard Wolfgang 2003-05-06
6324072 Microelectronic component of sandwich construction Leo Lorenz, Michael Kaindl, Gerhard Munzing, Peter Stern, Manfred Bruckmann 2001-11-27
6175148 Electrical connection for a power semiconductor component 2001-01-16
5893511 Pressure sintering method for fastening electronic components on a substrate 1999-04-13
5663574 Power semiconductor component with monolithically integrated sensor arrangement as well as manufacture and employment thereof Christofer Hierold 1997-09-02
5654586 Power semiconductor component having a buffer layer 1997-08-05
5379942 Method for producing a semiconductor modular structure Reinhold Kuhnert 1995-01-10
5158226 Method and arrangement for connecting a semiconductor to a substrate or for after-treatment of a semiconductor-to-substrate connection with contact-free pressing 1992-10-27
5077224 Thyristor with high positive and negative blocking capability and method for the manufacture thereof Reinhold Kuhnert 1991-12-31
5072312 Thyristor with high positive and negative blocking capability Reinhold Kuhnert 1991-12-10
5067647 Apparatus for fastening semiconductor components to substrates 1991-11-26
5058796 Apparatus for fastening electronic components to substrates 1991-10-22
4903885 Method and apparatus for fastening electronic components to substrates 1990-02-27
4903886 Method and apparatus for fastening semiconductor components to substrates 1990-02-27
4810672 Method of securing electronic components to a substrate 1989-03-07