Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9064707 | Bonding contact area on a semiconductor substrate | Pascal Stumpf | 2015-06-23 |
| 8143076 | Manufacture of defect cards for semiconductor dies | Joerg Krause | 2012-03-27 |
| 5445998 | Method for the global planarization of surfaces of semiconductor integrated circuits | — | 1995-08-29 |