Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7521791 | Method and apparatus for dissipating heat from an integrated circuit | Justin R. Wodrich, Michael S. Beard, Anbuselvan Kuppusamy, Zalman Schwartzman, James L. Stephens +1 more | 2009-04-21 |
| 5860583 | Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow | Henry F. Liebman, Anthony J. Suppelsa | 1999-01-19 |
| 5647529 | Method of controlling the temperature of a portion of an electronic part during solder reflow | Henry F. Liebman, Anthony J. Suppelsa | 1997-07-15 |