Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358878 | N-aromatic amide compounds, preparation methods and uses thereof | Lijun Yu, Junze He, Meijuan Duan | 2025-07-15 |
| 12162790 | Overflow brick and sheet forming thickness control method therefor | Miao Li, Menghu LI, Dacheng Wang, Zhijun Zhang | 2024-12-10 |
| 11952487 | Resin spacer for chip stacking and packaging and preparation method thereof | — | 2024-04-09 |
| 11760727 | N-aromatic amide compounds, preparation methods and uses thereof | Lijun Yu, Junze He, Meijuan Duan | 2023-09-19 |
| 11462448 | Step-type stacked chip packaging structure based on resin spacer and preparation process | — | 2022-10-04 |