Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6794762 | Electronic component and fabrication method thereof | Tomonobu Sugimoto | 2004-09-21 |
| 6674178 | Semiconductor device having dispersed filler between electrodes | — | 2004-01-06 |
| 6670706 | Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same | — | 2003-12-30 |
| 6653171 | Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method | — | 2003-11-25 |
| 6617688 | Semiconductor device and flat electrodes | Nobuaki Nagai | 2003-09-09 |
| 6608372 | Surface mountable chip type semiconductor device and manufacturing method | — | 2003-08-19 |
| 6504240 | Semiconductor device having reliable coupling between wiring substrate and semiconductor pellet | — | 2003-01-07 |
| 6433426 | Semiconductor device having a semiconductor with bump electrodes | — | 2002-08-13 |
| 6406989 | Method of fabricating semiconductor device with bump electrodes | — | 2002-06-18 |
| 6194781 | Semiconductor device and method of fabricating the same | — | 2001-02-27 |
| 6137184 | Flip-chip type semiconductor device having recessed-protruded electrodes in press-fit contact | — | 2000-10-24 |