Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11618094 | Solder ball feeding device | — | 2023-04-04 |
| 11554434 | Method and laser arrangement for fusing a solder material deposit by means of laser energy | — | 2023-01-17 |
| 11224928 | Device for the separate application of solder material deposits | — | 2022-01-18 |
| 10695853 | Device for the separate application of bonding material deposits | Thorsten Krause | 2020-06-30 |
| 10634699 | Device for removing a test contact of a test contact arrangement | Thorsten Krause | 2020-04-28 |
| 10354971 | Method for producing a chip module | Thorsten Teutsch, Ricardo Geelhaar | 2019-07-16 |
| 10286470 | Device for the separate application of connecting material deposits | — | 2019-05-14 |
| 10118240 | Method for forming solder deposits | — | 2018-11-06 |
| 10081068 | Device for the separate application of solder material deposits | — | 2018-09-25 |
| 9685423 | Semiconductor chip assembly and method for manufacturing the same | — | 2017-06-20 |
| 9649711 | Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium | — | 2017-05-16 |
| 9401298 | Method and device for transferring a chip to a contact substrate | Elke Zakel | 2016-07-26 |
| 9327360 | Method and device for contacting, positioning and impinging a solder ball formation with laser energy | — | 2016-05-03 |
| 8988094 | Test contact arrangement | — | 2015-03-24 |
| 8742571 | Diode array and method for producing a diode array | Elke Zakel, Thorsten Teutsch, Siavash Tabrizi | 2014-06-03 |
| 8480298 | Device for positioning and contacting test contacts | — | 2013-07-09 |
| 8361881 | Method for alternately contacting two wafers | Elke Zakel | 2013-01-29 |
| 8330076 | Method and device for removing solder material deposits from a substrate | — | 2012-12-11 |
| 8328068 | Transfer device for receiving and transferring a solder ball arrangement | Siavash Tabrizi | 2012-12-11 |
| 8256131 | Method and device for drying circuit substrates | Elke Zakel | 2012-09-04 |
| 8205325 | Device for applying an electronic component | — | 2012-06-26 |
| 8087163 | Method of manufacturing a contact arrangement between a microelectronic component and a carrier | — | 2012-01-03 |
| 7932611 | Device for alternately contacting two wafers | Elke Zakel | 2011-04-26 |
| 7926699 | Method and device for transferring a solder deposit configuration | Elke Zakel | 2011-04-19 |
| 7882997 | Method and device for mutual contacting of two wafers | Elke Zakel | 2011-02-08 |