Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5076096 | Molding of thermoset materials | Lee L. Blyler, Jr., Philip Hubbauer, Richard C. Progelhof | 1991-12-31 |
| 4927590 | Method for encapsulating integrated circuits | — | 1990-05-22 |
| 4837129 | Process for producing conductor patterns on three dimensional articles | David C. Frisch, Louis Thomas Manzione, Wilhelm Weber | 1989-06-06 |