Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7909596 | Resin molding machine and method of resin molding | Yoshio Watanabe, Tetsuya Nishizawa, Hiroaki Yamagishi, Mitsugi Yoshino, Takashi Katayama | 2011-03-22 |
| 7407608 | Resin molding equipment and resin molding method | Kazuhiko Kobayashi, Kenji Nakajima, Naoya Gotoh, Kazuro Wada, Haruhisa Makino +1 more | 2008-08-05 |
| 6770236 | Method of resin molding | — | 2004-08-03 |
| 6743389 | Resin molding machine and method of resin molding | Kunihiro Aoki, Tsutomu Miyagawa, Hideaki Nakazawa | 2004-06-01 |
| 6478562 | Resin molding machine | — | 2002-11-12 |
| 6459159 | Apparatus for sealing a semiconductor device utilizing a release film | Tsutomu Miyagawa, Kunihiro Aoki, Masahiro Kodama | 2002-10-01 |
| 6444157 | Method of resin molding | — | 2002-09-03 |
| 6350113 | Resin molding machine | — | 2002-02-26 |
| 6344162 | Method of manufacturing semiconductor devices and resin molding machine | — | 2002-02-05 |
| 6261501 | Resin sealing method for a semiconductor device | Tsutomu Miyagawa, Kunihiro Aoki, Masahiro Kodama | 2001-07-17 |
| 6224360 | Resin sealing device for chip-size packages | — | 2001-05-01 |
| 6187243 | Method of resin molding | — | 2001-02-13 |
| 6080354 | Resin molding method in which a movable cavity piece allows a direct resin feed | — | 2000-06-27 |
| 6048483 | Resin sealing method for chip-size packages | — | 2000-04-11 |
| 5891384 | Method of operating a molding machine with release film | — | 1999-04-06 |
| 5891483 | Automatic molding machine using release film | — | 1999-04-06 |
| 5824252 | Method of resin molding and resin molding machine for the same | — | 1998-10-20 |
| 5800841 | Resin molding machine | — | 1998-09-01 |
| 5507910 | Lead frame taping machine | — | 1996-04-16 |