| 7186923 |
Printed wiring boards and methods for making them |
Charles Edwin Thorn, Charles A. Mosolf |
2007-03-06 |
| 6710259 |
Printed wiring boards and methods for making them |
Charles Edwin Thorn, Charles A. Mosolf |
2004-03-23 |
| 6691912 |
Methods of avoiding blowhole formation by conditioning through holes and glass |
Michael V. Carano |
2004-02-17 |
| 6454868 |
Permanganate desmear process for printed wiring boards |
William Yang, Charles Edwin Thorn, Michael V. Carano, Beth Ann LaFayette |
2002-09-24 |
| 6440331 |
Aqueous carbon composition and method for coating a non conductive substrate |
Michael V. Carano |
2002-08-27 |
| 6375731 |
Conditioning of through holes and glass |
Michael V. Carano |
2002-04-23 |
| 6303181 |
Direct metallization process employing a cationic conditioner and a binder |
Charles Edwin Thorn, Charles A. Mosolf |
2001-10-16 |
| 6171468 |
Direct metallization process |
Charles Edwin Thorn, Charles A. Mosolf |
2001-01-09 |
| 6037020 |
Ultrasonic mixing of through hole treating compositions |
Gregory Dean Garlough, Benjamin Todd Carroll, Michael V. Carano |
2000-03-14 |
| 5985040 |
Permanganate desmear process for printed wiring boards |
Michael V. Carano, Beth Ann LaFayette |
1999-11-16 |
| 5725807 |
Carbon containing composition for electroplating |
Charles Edwin Thorn, Charles A. Mosolf |
1998-03-10 |
| 5690805 |
Direct metallization process |
Charles Edwin Thorn, Charles A. Mosolf |
1997-11-25 |
| 5476580 |
Processes for preparing a non-conductive substrate for electroplating |
Charles Edwin Thorn, Charles A. Mosolf |
1995-12-19 |
| 5389270 |
Composition and process for preparing a non-conductive substrate for electroplating |
Charles Edwin Thorn, Charles A. Mosolf |
1995-02-14 |
| 4622108 |
Process for preparing the through hole walls of a printed wiring board for electroplating |
Anthony M. Piano |
1986-11-11 |