Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515891 | Radial solder ball pattern for attaching semiconductor and micromechanical chips | Wei-Chung Lee, Zhi Wei Low | 2019-12-24 |
| 10109570 | Radial solder ball pattern for attaching semiconductor and micromechanical chips | Wei-Chung Lee, Zhi Wei Low | 2018-10-23 |