EU

Emi Ushioda

TO Tokuyama: 2 patents #163 of 562Top 30%
Overall (All Time): #2,015,480 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9462698 Metallized substrate, metal paste composition, and method for manufacturing metallized substrate Naoto Takahashi, Yasuyuki Yamamoto 2016-10-04
9017563 Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid Tetsuo Imai 2015-04-28