Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10028370 | Suspension board and load beam combination including a positioning reference hole and a reinforcing layer | Yasunari Ooyabu, Tetsuya Ohsawa | 2018-07-17 |
| 9843216 | Coil printed circuit board, power reception module, battery unit and power reception communication module | Tadao Ookawa, Akihito MATSUTOMI, Shotaro Masuda | 2017-12-12 |
| 9072207 | Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit | Yasunari Ooyabu, Tetsuya Ohsawa | 2015-06-30 |
| 8452138 | Optical sensor module | Ryusuke Naito, Masayuki Hodono, Yusuke Shimizu, Kei Nakamura | 2013-05-28 |
| 7646611 | Printed circuit board and manufacturing method thereof | Yasuto Ishimaru, Toru Mizutani | 2010-01-12 |
| D585394 | Groove formed around a semiconductor device on a circuit board | Tetsuya Ohsawa | 2009-01-27 |
| D584250 | Grooves formed around a semiconductor device on a circuit board | Tetsuya Ohsawa | 2009-01-06 |
| D584249 | Grooves formed around a semiconductor device on a circuit board | Tetsuya Ohsawa | 2009-01-06 |
| D577691 | Grooves formed around a semiconductor device on a circuit board | Tetsuya Ohsawa | 2008-09-30 |
| D577692 | Grooves formed around a semiconductor device on a circuit board | Tetsuya Ohsawa | 2008-09-30 |
| D568836 | Groove formed around a semiconductor device on a circuit board | Tetsuya Ohsawa | 2008-05-13 |
| D567774 | Groove formed around a semiconductor device on a circuit board | Tetsuya Ohsawa | 2008-04-29 |
| D566060 | Grooves formed around a semiconductor device on a circuit board | Tetsuya Ohsawa | 2008-04-08 |