Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11434566 | Deposition apparatus capable of applying powder particles, and method for applying powder particles | — | 2022-09-06 |
| 6797135 | Electroplating apparatus | Jae-Jeong Kim, Jae-Hee Ha | 2004-09-28 |
| 6372116 | Method of forming a conductive layer and an electroplating apparatus thereof | Jae-Jeong Kim, Jae-Hee Ha | 2002-04-16 |
| 5795796 | Method of fabricating metal line structure | — | 1998-08-18 |