Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4685631 | Apparatus for feeding bonding wire | John A. Kurtz, Mark D. Dufour | 1987-08-11 |
| 4603802 | Variation and control of bond force | John A. Kurtz, Mark D. Dufour | 1986-08-05 |
| 4597519 | Lead wire bonding with increased bonding surface area | John A. Kurtz, Mark D. Dufour | 1986-07-01 |
| 4555052 | Lead wire bond attempt detection | John A. Kurtz, Mark D. Dufour | 1985-11-26 |
| 4498638 | Apparatus for maintaining reserve bonding wire | John A. Kurtz, Mark D. Dufour | 1985-02-12 |
| 4482794 | Pulse-width control of bonding ball formation | John A. Kurtz, Mark D. Dufour | 1984-11-13 |
| 4476365 | Cover gas control of bonding ball formation | John A. Kurtz | 1984-10-09 |
| 4476366 | Controlled bonding wire ball formation | John A. Kurtz, Mark D. Dufour | 1984-10-09 |
| 4434347 | Lead frame wire bonding by preheating | John A. Kurtz | 1984-02-28 |
| 4390771 | Bonding wire ball forming method and apparatus | John A. Kurtz | 1983-06-28 |