DK

Dan Kurtz

UC Us Conec: 1 patents #43 of 66Top 70%
IBM: 1 patents #44,794 of 70,183Top 65%
Overall (All Time): #3,105,444 of 4,157,543Top 75%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8724937 Fiber to wafer interface Tymon Barwicz, Darrell R. Childers 2014-05-13