Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778731 | Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board | Thanh T. Tran, Alton Moore, Paul Ingerson | 2023-10-03 |
| 11374541 | Common mode rejection for differential receiver in high speed data channel | Thanh T. Tran | 2022-06-28 |