CY

Chiao-Jung Yeh

📍 Xihu, TW: #280 of 466 inventorsTop 65%
Overall (All Time): #3,165,401 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8476746 Package structure enhancing molding compound bondability Cheng Yu Hsia 2013-07-02