Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8687368 | Heat-dissipating module and assembled structure of heat-dissipating module and integrated circuit chipset | Ching-Hsing Liao | 2014-04-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8687368 | Heat-dissipating module and assembled structure of heat-dissipating module and integrated circuit chipset | Ching-Hsing Liao | 2014-04-01 |