Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5811317 | Process for reflow bonding a semiconductor die to a substrate and the product produced by the product | Abhay Maheshwari, Sunil Thomas | 1998-09-22 |
| 5679266 | Method for assembly of printed circuit boards with ultrafine pitch components using organic solderability preservatives | Vijay S. Darekar, John W. Krueger | 1997-10-21 |