Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7339268 | Thermal dissipation from a flip chip through an aperture in a flex cable | Shufun Ho, Alex Y. Tsay, Ali Hosseinzadeh, Dennis W. Hogg | 2008-03-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7339268 | Thermal dissipation from a flip chip through an aperture in a flex cable | Shufun Ho, Alex Y. Tsay, Ali Hosseinzadeh, Dennis W. Hogg | 2008-03-04 |