Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7656031 | Stackable semiconductor package having metal pin within through hole of package | Cheng-Chung Chen, Chia-Chung Wang, Charles W. C. Lin | 2010-02-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7656031 | Stackable semiconductor package having metal pin within through hole of package | Cheng-Chung Chen, Chia-Chung Wang, Charles W. C. Lin | 2010-02-02 |