Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7714427 | Integrated circuit die configuration for packaging | Chee Wai Wong | 2010-05-11 |
| 7341887 | Integrated circuit die configuration for packaging | Chee Wai Wong | 2008-03-11 |
| 7081800 | Package integrated one-quarter wavelength and three-quarter wavelength balun | Jianggi He, Udy Shrivastava | 2006-07-25 |