Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444058 | Package structure with separated street between chips | Teng-Jui Yu, Wei Kang Tsai | 2022-09-13 |
| 10643921 | Chip on film package | Wen-Ching Huang, Ling-Chieh Li | 2020-05-05 |
| 10418305 | Chip on film package | Wen-Ching Huang, Ling-Chieh Li | 2019-09-17 |
| 10236234 | Chip on film package | Wen-Ching Huang | 2019-03-19 |
| 10079194 | Chip on film package | Wen-Ching Huang | 2018-09-18 |