CH

Chia-Yen Hsu

DI Datavan International: 4 patents #3 of 11Top 30%
TSMC: 2 patents #6,667 of 12,232Top 55%
Overall (All Time): #782,930 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12382734 Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the same Feng-Chien Hsieh, Yun-Wei Cheng, Wei-Li Hu, Kuo-Cheng Lee, Hsin-Chi Chen 2025-08-05
12324254 Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the same Feng-Chien Hsieh, Yun-Wei Cheng, Wei-Li Hu, Kuo-Cheng Lee, Hsin-Chi Chen 2025-06-03
7304835 Mainframe and power supply arrangement Kang Ku, Hsien-Tang Liu 2007-12-04
7265967 Housing for monitor Miao-Tzu Chou, Chia-Shiang Pan 2007-09-04
7121879 Anti-escape socket and plug arrangement Miao-Tzu Chou, Kuang-Yu Tseng 2006-10-17
7064954 Mainframe cooling structure Chia-Chuan Wu, Chuan-Chun Chiu 2006-06-20