Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136587 | Lead frame for a die | Dolores Babaran Milo | 2024-11-05 |
| 11049800 | Semiconductor device package with grooved substrate | Dolores Babaran Milo | 2021-06-29 |
| 10872785 | QFN pin routing thru lead frame etching | Dolores Babaran Milo | 2020-12-22 |
| 10573583 | Semiconductor device package with grooved substrate | Dolores Babaran Milo | 2020-02-25 |
| 10384325 | Dual-thickness backgrinding tape for backgrinding bumped wafers | Randy Collo Ramos, Jeniffer Viera Otero, Mark Daniel Pabalate Minoc, Russel Rosales Borreo | 2019-08-20 |
| 10361098 | QFN pin routing thru lead frame etching | Dolores Babaran Milo | 2019-07-23 |