| 10229956 |
High resolution low power consumption OLED display with extended lifetime |
Michael Hack, Michael S. Weaver, Julia J. Brown, Woo-Young So |
2019-03-12 |
| 5426266 |
Die bonding connector and method |
Davar I. Roshanagh |
1995-06-20 |
| 5126820 |
Thermal expansion compensated metal lead frame for integrated circuit package |
— |
1992-06-30 |
| 4931852 |
High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package |
Homi Fatemi |
1990-06-05 |
| 4918511 |
Thermal expansion compensated metal lead frame for integrated circuit package |
— |
1990-04-17 |
| 4820976 |
Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts |
— |
1989-04-11 |
| 4801999 |
Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers |
James Hayward |
1989-01-31 |
| 4729061 |
Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
— |
1988-03-01 |
| 4640010 |
Method of making a package utilizing a self-aligning photoexposure process |
— |
1987-02-03 |
| 4616406 |
Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein |
— |
1986-10-14 |