| 6873041 |
Power semiconductor package with strap |
Sean T. Crowley, William M. Anderson, Eelco Bergman |
2005-03-29 |
| 6756658 |
Making two lead surface mounting high power microleadframe semiconductor packages |
Blake A. Gillett, Sean T. Crowley, Keith M. Edwards |
2004-06-29 |
| 6707138 |
Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe |
Sean T. Crowley, Blake A. Gillett, Philip S. Mauri, Ferdinand E. Belmonte, Remigio V. Burro, Jr. +1 more |
2004-03-16 |
| 6630726 |
Power semiconductor package with strap |
Sean T. Crowley, William M. Anderson, Eelco Bergman |
2003-10-07 |
| 6521982 |
Packaging high power integrated circuit devices |
Sean T. Crowley, Blake A. Gillett |
2003-02-18 |
| 6396130 |
Semiconductor package having multiple dies with independently biased back surfaces |
Sean T. Crowley |
2002-05-28 |
| 6198163 |
Thin leadframe-type semiconductor package having heat sink with recess and exposed surface |
Sean T. Crowley |
2001-03-06 |