| 9899362 |
Mold chase for integrated circuit package assembly and associated techniques and configurations |
— |
2018-02-20 |
| 9067342 |
Mold chase for integrated circuit package assembly and associated techniques and configurations |
— |
2015-06-30 |
| 8534574 |
Underfill material dispenser |
Curtis S. White, Sung Won Moon |
2013-09-17 |
| 8366982 |
Differential pressure underfill process and equipment |
— |
2013-02-05 |
| 8211501 |
Fluorination pre-treatment of heat spreader attachment indium thermal interface material |
— |
2012-07-03 |
| 7829195 |
Fluorination pre-treatment of heat spreader attachment indium thermal interface material |
— |
2010-11-09 |
| 6989972 |
Magnetoresistive sensor with overlapping leads having distributed current |
Kroum S. Stoev, Mathew Gibbons, Francis H. Liu, Aparna C. Vadde, Jing Zhang +2 more |
2006-01-24 |
| 6278595 |
Magnetoresistive sensor having a hard-biasing material and a cubic-titanium-tungsten underlayer |
Song S. Xue, James F. Dolejsi, Patrick J. Ryan |
2001-08-21 |
| 6185081 |
Bias layers which are formed on underlayers promoting in-plane alignment of the c-axis of cobalt used in magnetoresistive transducers |
Yingjian Chen, Mark S. Miller |
2001-02-06 |