Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080697 | Method for forming a three-dimensional (3D) memory device having bonded semiconductor structures | Shiqi Huang, Wei Liu, Siping Hu | 2024-09-03 |
| 11450653 | Bonded three-dimensional memory devices having bonding layers | Shiqi Huang, Wei Liu, Siping Hu | 2022-09-20 |
| 11233041 | Bonded three-dimensional memory devices and methods for forming the same | Shiqi Huang, Wei Liu, Siping Hu | 2022-01-25 |
| 11037945 | Bonded three-dimensional memory devices and methods for forming the same | Shiqi Huang, Wei Liu, Siping Hu | 2021-06-15 |