Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10065273 | Solder material, method for the production thereof and use thereof to join metal substrates without pressure | Tobias Roehrich | 2018-09-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10065273 | Solder material, method for the production thereof and use thereof to join metal substrates without pressure | Tobias Roehrich | 2018-09-04 |