Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11865755 | Large part injection mold apparatus and process | William Henderson, Ling Feng | 2024-01-09 |
| 11491693 | Large part injection mold apparatus and process | William Henderson, Ling Feng | 2022-11-08 |