Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10409358 | Multi-chip module package compact thermal models | Vamsi Krishna Yaddanapudi, Aniket Kulkarni, Manoj Nagulapally | 2019-09-10 |
| 9715571 | Systems and methods for simulations of reliability in printed circuit boards | Rajiv Lochan Rath, Vamsi Krishna Yaddanapudi | 2017-07-25 |