Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5097406 | Lead frame lead located for wire bonder | Mandayam Narasimhan, Virge W. McClure | 1992-03-17 |
| 4993534 | Method and apparatus for reliable integrated circuit package construction | John Stewart | 1991-02-19 |
| 4887352 | Method for making matrix lead frame | — | 1989-12-19 |
| 4514750 | Integrated circuit package having interconnected leads adjacent the package ends | — | 1985-04-30 |