| 10943321 |
Method and system for processing image data |
Marie Flynn, Michael J. Flynn |
2021-03-09 |
| 10930013 |
Method and system for calibrating imaging system |
Michael J. Flynn |
2021-02-23 |
| 10163213 |
3D point clouds |
Michael J. Flynn |
2018-12-25 |
| 10158793 |
Processing survey data of an underwater scene |
Michael J. Flynn |
2018-12-18 |
| 10116842 |
Gathering range and dimensional information for underwater surveys |
Michael J. Flynn, James Mahon |
2018-10-30 |
| 10116841 |
Relation to underwater imaging for underwater surveys |
Michael J. Flynn |
2018-10-30 |
| 9352417 |
Increasing die strength by etching during or after dicing |
Oonagh Meighan |
2016-05-31 |
| 8551792 |
Dicing a semiconductor wafer |
Joseph Callaghan, Fintan McKiernan |
2013-10-08 |
| 8048774 |
Methods and systems for laser machining a substrate |
Oonagh Meignan |
2011-11-01 |
| 7989320 |
Die bonding |
David Gillen, Maria Farsari |
2011-08-02 |
| 7887712 |
Laser machining system and method |
Oonagh Meighan, Gillian Walsh, Kia Woon Mah |
2011-02-15 |
| 7776720 |
Program-controlled dicing of a substrate using a pulsed laser |
Oonagh Meighan |
2010-08-17 |
| 6983066 |
Machine vision |
James Mahon, Niall Burke, Karl R. Stanley, Brian M. Farrell, Peter Conlon |
2006-01-03 |
| 6841482 |
Laser machining of semiconductor materials |
— |
2005-01-11 |
| 6781093 |
Circuit singulation system and method |
Peter Conlon, James Mahon, Mark D. Owen |
2004-08-24 |
| 6697151 |
Material inspection |
Mark D. Owen, Peter Conlon |
2004-02-24 |
| 6697154 |
Microvia inspection system |
Mark D. Owen, Niall Dorr, James Mahon, Peter Conlon |
2004-02-24 |
| 6671397 |
Measurement system having a camera with a lens and a separate sensor |
James Mahon, Niall Dorr, Peter Conlon |
2003-12-30 |
| 6586707 |
Control of laser machining |
Kali Dunne, Maria Farsari |
2003-07-01 |