Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426504 | Solid-state cooler device with grid point contacts | John X. Przybysz, Edward R. Engbrecht, Robert M. Young | 2025-09-23 |
| 12394688 | Superconducting device including set of circuits having different operational temperature requirements with multiple thermal sinks and multiple ground planes | Gregory R. Boyd, John X. Przybysz | 2025-08-19 |
| 12027437 | Superconducting device having a plurality of thermal sink layers and a plurality of ground planes | Gregory R. Boyd, John X. Przybysz | 2024-07-02 |
| 11950510 | Superconductor junction for a solid state cooler | Edward R. Engbrecht, John X. Przybysz, Robert M. Young | 2024-04-02 |
| 11839165 | Cooler device with aluminum oxide insulators | John X. Przybysz, Robert M. Young, Edward R. Engbrecht | 2023-12-05 |
| 11600760 | Cooler device with aluminum oxide insulators | John X. Przybysz, Robert M. Young, Edward R. Engbrecht | 2023-03-07 |
| 11333413 | Solid state cooler device | Robert M. Young, John X. Przybysz, Gregory R. Boyd, Zachary A. Stegen, Edward R. Engbrecht +2 more | 2022-05-17 |
| 11189773 | Superconductor thermal filter | Robert M. Young, John X. Przybysz, Greg Boyd, Zachary Kyle Keane | 2021-11-30 |
| 11004763 | Superconducting device with multiple thermal sinks | Gregory R. Boyd, John X. Przybysz | 2021-05-11 |
| 10998485 | Cooler device with superconductor shunts | John X. Przybysz, Robert M. Young, Edward R. Engbrecht, Monica P. Lilly | 2021-05-04 |
| 10727162 | Integrated circuit having a heat sink coupled to separate ground planes through vias with different thermal characteristics | Patrick Alan Loney, Robert M. Young, Daniel R. Queen, John X. Przybysz | 2020-07-28 |
| 10644218 | Multichip device with temperature isolating bump bonds | Robert M. Young, Patrick Alan Loney, JUSTIN C. HACKLEY | 2020-05-05 |
| 10629535 | Thermally isolated ground planes with a superconducting electrical coupler | Patrick Alan Loney, Daniel R. Queen, John X. Przybysz, Robert M. Young | 2020-04-21 |
| 10229864 | Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias | Patrick Alan Loney, Robert M. Young, Daniel R. Queen, John X. Przybysz | 2019-03-12 |
| 10128592 | Integrated circuit interface and method of making the same | Robert H. Miller, Erica Anne Sanker | 2018-11-13 |