Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11253955 | Multi-segment focusing lens and the laser processing for wafer dicing or cutting | Egidijus Vanagas, Karolis Zilvinas Bazilevicius | 2022-02-22 |
| 10916461 | Method of laser scribing of semiconductor workpiece using divided laser beams | Egidijus Vanagas, Laurynas Veselis | 2021-02-09 |
| 10074565 | Method of laser processing for substrate cleaving or dicing through forming “spike-like” shaped damage structures | Egidijus Vanagas, Laurynas Veselis | 2018-09-11 |